GLOBALFOUNDRIES Inc. is the world's second largest independent semiconductor foundry (after TSMC), with its headquarters located in Milpitas, California. GLOBALFOUNDRIES was created by the divestiture of the manufacturing side of AMD on March 2, 2009, and was expanded through its merger with Chartered Semiconductor on January 13, 2010. The Emirate of Abu Dhabi is the largest investor in the company via its subsidiary ATIC. On March 4, 2012, AMD has announced that they have divested their final 14% stake in the company, which concludes AMD's multi-year plan to divest its manufacturing arm.[2]
GLOBALFOUNDRIES manufactures integrated circuits in high volume mostly for semiconductor companies such as AMD, Broadcom, Qualcomm, and STMicroelectronics.
The company has five 200mm fabrication plants in Singapore, and two 300 mm fabrication plants each in Germany and Singapore, as well as a new 300mm fabrication plant in Malta, Saratoga County, New York in the United States scheduled to begin volume production in 2013.[3]
Overview
GLOBALFOUNDRIES services the manufacturing needs of its customers through its high volume foundry services. It currently owns eight fabrication plants. Fab 1 is in Dresden, Germany. Fabs 2 through 7 are in Singapore, and a new plant, Fab 8, will be operational in the United States in 2012. These sites are supported by a global network of R&D, design enablement, and customer support in Singapore, China, Taiwan, Japan, the United States, Germany, and the United Kingdom. [4]
Fabrication facilities
300mm fabrication facilities[3]
GlobalFoundries Fab 1 in Dresden, Germany
Fab 1
Fab 1, located in Dresden, Germany is a 364,512 m² plant. When transferred to GLOBALFOUNDRIES in its inception, Fab 36 and Fab 38 were renamed Module 1 and Module 2, respectively. Each module can produce 25,000 wafers per month.[3][5]
Module 1 is a 300mm wafer production facility. It is capable of manufacturing wafers at 65 nm and 45 nm for use in AMD CPUs, APUs, and future 32 nm SOI HKMG silicon.
Module 2 is in a transition period, converting from 200mm to 300mm wafer production for 55 nm and 40 nm for use in chipsets, GPUs, and future 32 nm and 28 nm bulk HKMG silicon.
- Maximum full capacity: 80,000 of 300mm wafers/month. (180,000 200mm wafers/month equivalent)
- Technologies: 45 nm and below.
Fab 7
Fab 7, located in Singapore, is an operational 300 mm Fab, originally owned by Chartered Semiconductor. It produces wafers at 130 nm to 40 nm on bulk CMOS and SOI processes. It is one of the most advanced fully automated fabs.[3]
- Maximum Full Capacity: 50,000 of 300mm wafers/month. (112,500 200mm wafers/month equivalent)
- Technology: 130 to 40 nm.
Fab 8
Fab 8, located in Luther Forest Technology Campus, Saratoga County, New York, USA is a new 300 mm Fab. This fabrication plant was previously named Fab 4x when it was still part of AMD. It is a new 20 nm wafer plant. The plant's construction began in July 2009 and the company started mass production in 2012.[3][6]
- Maximum Full Capacity: 60,000 of 300mm wafers/month. (More than 135,000 200mm wafers/month equivalent)
- Technology: 28 nm and below.
200mm fabrication facilities
All 200 mm fabs are located in Singapore, and originally owned by Chartered Semiconductor.[7]
Fab 2
Fab 2 is located at Singapore capable of manufacturing wafers at 600 to 350 nm for use in selected automotive IC products, High Voltage power management IC and Mixed-Signal products.[7]
- Maximum Full Capacity: 50,000 of 200mm wafers/month.
- Technology: 600 to 350 nm.
Fab 3/5
Fab 3/5 is capable of manufacturing wafers at 350 to 180 nm for use in High Voltage IC's for small panel display drivers and mobile power management modules.[7]
- Maximum Full Capacity: 54,000 of 200mm wafers/month.
- Technology: 350 to 180 nm.
Fab 3E
Fab 3E produces 180 nm wafers for use in selected automotive IC products, High Voltage power management IC and Mixed-Signal products with embedded non-volatile memory technology.[7]
- Maximum Full Capacity: 34,000 of 200mm wafers/month.
- Technology: 180 nm.
Fab 6
Fab 6 is a full copper fab that is capable of highly integrated CMOS and RFCMOS products for applications such as Wi-Fi / Bluetooth at 180 to 110 nm processes.[7]
- Maximum Full Capacity: 45,000 of 200mm wafers/month
- Technology: 180 to 110 nm.
Merger with Chartered Semiconductor
The majority investor of GLOBALFOUNDRIES, Abu Dhabi's Advanced Technology Investment Co., announced on Sept. 6, 2009, that it has agreed to acquire Singapore-based Chartered Semiconductor Manufacturing Co. Ltd., for a total of $3.9 billion, with Chartered's operations being folded into GLOBALFOUNDRIES .[8]
Ajit Manocha is the acting Chief Executive Officer (CEO) of GlobalFoundries.[9]
Chartered Semiconductor is a member of the Common Platform, IBM's semiconductor technology alliance. GlobalFoundries is a JDA partner of Common Platform Technology Alliance.
See also
References
- ^ a b GLOBALFOUNDRIES Fast Facts
- ^ Shimpi, Anand Lal. "GLOBALFOUNDRIES Granted Independence, Acquires Remaining Stake from AMD". AnandTech. http://www.anandtech.com/show/5627/gl obalfoundries-granted-independence-ac quires-remaining-stake-from-amd. Retrieved December 8, 2012.
- ^ a b c d e GLOBALFOUNDRIES 300mm Manufacturing Facilities
- ^ GlobalFoundries Unveils Industry's First 28nm Signoff-Ready Digital Design Flows; Press Release; January 13, 2011.
- ^ Globalfoundries Dresden, Germany
- ^ GlobalFoundries Saratoga County, New York, USA
- ^ a b c d e GlobalFoundries 200mm Manufacturing Facilities
- ^ EETimes article
- ^ "Press Release", Reuters, accessed June 16, 2011.
External links
